기술지원

나노펩센터장비소개

장비소개
공정 장비명 용도
Deposition Furnace/LPCVD1,2 Sio2 산화막 형성
Furnace/LPCVD(P) 산화막/폴리실리콘
LPCVD3,4 박막(Sio2,SixNx)증착
PECVD1 박막(Sio2,SixNx)증착
PECVD2 박막(Sio2,SixNx)증착
Parylene packaging sys 고분자 유기물 증착
E-Beam Evaporator Metal 박막 증착
SG101 Electroform Sys Ni 도금
Sputter 다층 금속 증착
Etching RIE 1 박막 식각
RIE 2 박막 식각
Deep Trench RIE(Si) Silicon 식각
AOE Etcher (Metal) Metal식각
Oxford Etcher(화합물) 혼합물 식각
XeF2 Etcher Silicon 식각
Microwave Plasma Asher 폴리머 제거
M-2000 Laser Die Saw/Patterning
Ion milling 박막식각
Inspection Micro Scope 1 Depth 측정/Inspection
Micro Scope 2 CD측정/Inspection
Micro Scope 2 CD/Depth/Inspection
Nanospec 박막두께 측정
4-Point Probe 저항 측정
Alphastep(ASIQ) 단차측정
E-SEM Profile 측정
Camscope surface Inspection
Photo Lithography E-Beam Lithography Nano Pattern 구현/Mask 제작
MA6 2 Lithography 공정
NANOTEC Lithography 공정
Spin Coater 1(4"용) PR Coating
Spin Coater 2(조각) PR Coating
Spin Dryer/Coater PR Coating
Oven/Hot Plate PR Baking
Hot Plate System PR Coating
Assembly Wire Bonder Wire Bonding
Wafer Bonder Wafer Bonding
Wet-Station Acid Wet-Station Chemical 식각/세정
Organic Wet-Station 1 Chemical 식각/세정
KOH Wet-Station Silicon 습식식각
Organic Wet-Station 2 Chemical 식각/세정
Spin Rinse Dryer Wafer 건조
Ultrasonic Chemical 세정