기술지원
나노펩센터장비소개
| 공정 | 장비명 | 용도 |
|---|---|---|
| Deposition | Furnace/LPCVD1,2 | Sio2 산화막 형성 |
| Furnace/LPCVD(P) | 산화막/폴리실리콘 | |
| LPCVD3,4 | 박막(Sio2,SixNx)증착 | |
| PECVD1 | 박막(Sio2,SixNx)증착 | |
| PECVD2 | 박막(Sio2,SixNx)증착 | |
| Parylene packaging sys | 고분자 유기물 증착 | |
| E-Beam Evaporator | Metal 박막 증착 | |
| SG101 Electroform Sys | Ni 도금 | |
| Sputter | 다층 금속 증착 | |
| Etching | RIE 1 | 박막 식각 |
| RIE 2 | 박막 식각 | |
| Deep Trench RIE(Si) | Silicon 식각 | |
| AOE Etcher (Metal) | Metal식각 | |
| Oxford Etcher(화합물) | 혼합물 식각 | |
| XeF2 Etcher | Silicon 식각 | |
| Microwave Plasma Asher | 폴리머 제거 | |
| M-2000 Laser | Die Saw/Patterning | |
| Ion milling | 박막식각 | |
| Inspection | Micro Scope 1 | Depth 측정/Inspection |
| Micro Scope 2 | CD측정/Inspection | |
| Micro Scope 2 | CD/Depth/Inspection | |
| Nanospec | 박막두께 측정 | |
| 4-Point Probe | 저항 측정 | |
| Alphastep(ASIQ) | 단차측정 | |
| E-SEM | Profile 측정 | |
| Camscope | surface Inspection | |
| Photo Lithography | E-Beam Lithography | Nano Pattern 구현/Mask 제작 |
| MA6 2 | Lithography 공정 | |
| NANOTEC | Lithography 공정 | |
| Spin Coater 1(4"용) | PR Coating | |
| Spin Coater 2(조각) | PR Coating | |
| Spin Dryer/Coater | PR Coating | |
| Oven/Hot Plate | PR Baking | |
| Hot Plate System | PR Coating | |
| Assembly | Wire Bonder | Wire Bonding |
| Wafer Bonder | Wafer Bonding | |
| Wet-Station | Acid Wet-Station | Chemical 식각/세정 |
| Organic Wet-Station 1 | Chemical 식각/세정 | |
| KOH Wet-Station | Silicon 습식식각 | |
| Organic Wet-Station 2 | Chemical 식각/세정 | |
| Spin Rinse Dryer | Wafer 건조 | |
| Ultrasonic | Chemical 세정 |
